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MX27L1000
FEATURES
1M-BIT [128Kx8] LOW VOLTAGE OPERATION CMOS EPROM * Operating current: 20mA @3.6V, 5MHz * Standby current: 10uA * Package type:
32 pin plastic DIP 32 pin SOP 32 pin TSOP 32 pin PLCC
* * * * * *
128K x 8 organization Wide power supply range, 2.7V DC to 3.6VDC +12.5V programming voltage Fast access time:90/120/150/200/250 ns Totally static operation Completely TTL compatible
GENERAL DESCRIPTION
The MX27L1000 is a 1M-bit, One Time Programmable Read Only Memory. It isorganized as 128K words by 8 bits per word, opeates from a single 2.7 to 3.6 volt supply, has a static standby mode, and features fast single address location programming. All programming signals are TTL levels, requirin a single pulse. For programming outside from the system, existing EPROM programmers may be used. The MX27L1000 supports a intelligent fast programming algorithm which can result in programming time of less than thirty seconds. This EPROM is packaged in industry standard 32 pin dual-in-line packages,32 lead SOP , 32 lead PLCC, and 32 lead TSOP packages.
PIN CONFIGURATIONS
32 PDIP/SOP
VPP A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VCC PGM NC A14 A13 A8 A9 A11 OE A10 CE Q7 Q6 Q5 Q4 Q3
32 PLCC
PGM VCC VPP A12 A15 A16 NC
BLOCK DIAGRAM
CE PGM OE CONTROL LOGIC OUTPUT BUFFERS Q0~Q17
A7 A6 A5 A4 A3 A2 A1 A0 Q0
5
4
1
32
30 29
A14 A13 A8 A9
. . . A0~A16 ADDRESS INPUTS . . . . . Y-DECODER . . . . . . . . Y-SELECT
MX27L1000
9
MX27L1000
25
A11 OE A10 CE
X-DECODER
1M BIT CELL MAXTRIX
13 14
17
21 20
Q7
VCC GND VPP
Q1
Q2
GND
Q3
Q4
Q5
Q6
PIN DESCRIPTION
32 TSOP
A11 A9 A8 A13 A14 NC PGM VCC VPP A16 A15 A12 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE A10 CE Q7 Q6 Q5 Q4 Q3 GND Q2 Q1 Q0 A0 A1 A2 A3
SYMBOL A0~A16 Q0~Q7 CE OE PGM VPP NC VCC GND
PIN NAME Address Input Data Input/Output Chip Enable Input Output Enable Input Programmable Enable Input Program Supply Voltage No Internal Connection Power Supply Pin Ground Pin
MX27L1000
P/N: PM0238
1
REV. 3.6, AUG. 20, 2001
MX27L1000
FUNCTIONAL DESCRIPTION
AUTO IDENTIFY MODE The auto identify mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and device type. This mode is intended for use by programming equipment for the purpose of automatically matching the device to be programmed with its corresponding programming algorithm. This mode is functional in the 25C 5 ambient temperature range C that is required when programming the MX27L1000. To activate this mode, the programming equipment must force 12.0 0.5 V on address line A9 of the device. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during auto identify mode. Byte 0 ( A0 = VIL) represents the manufacturer code, and byte 1 (A0 = VIH), the device identifier code. For the MX27L1000, these two identifier bytes are given in the Mode Select Table. All identifiers for manufacturer and device codes will possess odd parity, with the MSB (Q7) defined as the parity bit.
THE PROGRAMMING OF THE MX27L1000 When the MX27L1000 is delivered, or it is erased, the chip has all 1M bits in the "ONE" or HIGH state. "ZERO" are loaded into the MX27L1000 through the procedure of programming. For programming, the data to be programmed is applied with 8 bits in parallel to the data pins. VCC must be applied simultaneously or before VPP, and removed simultaneously or after VPP. When programming an MXIC EPROM, a 0.1uF capacitor is required across VPP and ground to suppress spurious voltage transients which may damage the device.
FAST PROGRAMMING The device is set up in the fast programming mode when the programming voltage VPP = 12.75V is applied, with VCC = 6.25 V and PGM = VIL(or OE = VIH) (Algorithm is shown in Figure 1). The programming is achieved by applying a single TTL low level 100us pulse to the PGM input after addresses and data line are stable. If the data is not verified, an additional pulse is applied for a maximum of 25 pulses. This process is repeated while sequencing through each address of the device. When the programming mode is completed, the data in all address is verified at VCC = VPP = 5V 10%.
READ MODE The MX27L1000 has two control functions, both of which must be logically satisfied in order to obtain data at the outputs. Chip Enable (CE) is the power control and should be used for device selection. Output Enable (OE) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that addresses are stable, address access time (tACC) is equal to the delay from CE to output (tCE). Data is available at the outputs tQE after the falling edge of OE, assuming that CE has been LOW and addresses have been stable for at least tACC - tOE.
PROGRAM INHIBIT MODE Programming of multiple MX27L1000s in parallel with different data is also easily accomplished by using the Program Inhibit Mode. Except for CE and OE, all like inputs of the parallel MX27L1000 may be common. A TTL low-level program pulse applied to an MX27L1000 CE input with VPP = 12.5 0.5 V and PGM LOW will program that MX27L1000. A high-level CE input inhibits the other MX27L1000s from being programmed.
STANDBY MODE The MX27L1000 has a CMOS standby mode which reduces the maximum VCC current to 10 uA. It is placed in CMOS standby when CE is at VCC 0.3 V. The MX27L1000 also has a TTL-standby mode which reduces the maximum VCC current to 0.25mA. It is placed in TTL-standby when CE is at VIH. When in standby mode, the outputs are in a high-impedance state, independent of the OE input.
PROGRAM VERIFY MODE Verification should be performed on the programmed bits to determine that they were correctly programmed. The verification should be performed with OE and CE at VIL, PGM at VIH, and VPP at its programming voltage.
P/N: PM0238
2
REV. 3.6 , AUG. 20, 2001
MX27L1000
TWO-LINE OUTPUT CONTROL FUNCTION To accommodate multiple memory connections, a twoline control function is provided to allow for: 1. Low memory power dissipation, 2. Assurance that output bus contention will not occur. It is recommended that CE be decoded and used as the primary device-selecting function, while OE be made a common connection to all devices in the array and connected to the READ line from the system control bus. This assures that all deselected memory devices are in their low-power standby mode and that the output pins are only active when data is desired from a particular memory device. SYSTEM CONSIDERATIONS During the switch between active and standby conditions, transient current peaks are produced on the rising and falling edges of Chip Enable. The magnitude of these transient current peaks is dependent on the output capacitance loading of the device. At a minimum, a 0.1 uF ceramic capacitor (high frequency, low inherent inductance) should be used on each device between Vcc and GND to minimize transient effects. In addition, to overcome the voltage drop caused by the inductive effects of the printed circuit board traces on EPROM arrays, a 4.7 uF bulk electrolytic capacitor should be used between Vcc and GND for each eight devices. The location of the capacitor should be close to where the power supply is connected to the array.
MODE SELECT TABLE
PINS MODE Read Output Disable Standby (TTL) Standby (CMOS) Program Program Verify Program Inhibit Manufacturer Code(3) Device Code(3) CE VIL VIL VIH VCC 0.3V VIL VIL VIH VIL VIL OE VIL VIH X X VIH VIL X VIL VIL PGM X X X X VIL VIH X X X A0 X X X X X X X VIL VIH A9 X X X X X X X VH VH VPP VCC VCC VCC VCC VPP VPP VPP VCC VCC OUTPUTS DOUT High Z High Z High Z DIN DOUT High Z C2H 0EH
NOTES: 1. VH = 12.0 V 0.5 V 2. X = Either VIH or VIL 3. A1 - A8 = A10 - A16 = VIL(For auto select) 4. See DC Programming Characteristics for VPP voltage during programming.
P/N: PM0238
3
REV. 3.6 , AUG. 20, 2001
MX27L1000
FIGURE 1. FAST PROGRAMMING FLOW CHART
START
ADDRESS = FIRST LOCATION
VCC = 6.25V VPP = 12.75V X=0
PROGRAM ONE 100us PULSE
INTERACTIVE SECTION
INCREMENT X
YES X = 25?
NO
FAIL
VERIFY BYTE
?
PASS NO INCREMENT ADDRESS LAST ADDRESS FAIL YES
VCC = VPP = 5.25V
VERIFY SECTION
VERIFY ALL BYTES ?
FAIL
DEVICE FAILED
PASS DEVICE PASSED
P/N: PM0238
4
REV. 3.6 , AUG. 20, 2001
MX27L1000
SWITCHING TEST CIRCUITS
DEVICE UNDER TEST
1.8K ohm +5V
CL 6.2K ohm
DIODES = IN3064 OR EQUIVALENT
CL = 100 pF including jig capacitance CL = 30 pF including jig capacitance for 90/120ns
SWITCHING TEST WAVEFORMS
2.0V
AC driving levels
2.0V TEST POINTS 0.8V OUTPUT
0.8V INPUT
AC TESTING: AC driving levels are 2.4V/0.4V for both commercial grade and industrial grade. Input pulse rise and fall times are < 10ns.
SWITCHING TEST WAVEFORMS (For Speed 90/120ns)
AC driving levels
1.5V
TEST POINTS
1.5V
INPUT
OUTPUT
AC TESTING: AC driving levels are 3.0V/0V for both commercial grade and industrial grade. Input pulse rise and fall times are < 10ns.
P/N: PM0238
5
REV. 3.6 , AUG. 20, 2001
MX27L1000
ABSOLUTE MAXIMUM RATINGS
RATING Storage Temperature Applied Input Voltage Applied Output Voltage VCC to Ground Potential V9 & VPP VALUE -65oC to 125oC -0.5V to 7.0V -0.5V to VCC+0.5V -0.5V to 7.0V -0.5V to 13.5V Ambient Operating Temperature -40oC to 85oC
NOTICE: Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended period may affect reliability. NOTICE: Specifications contained within the following tables are subject to change.
DC/AC Operating Conditions for Read Operation
MX27L1000 -90 Operating Temperature Commercial Industrial Vcc Power Supply 0 to 70C C -12 0C to 70C -15 0C to 70 C -20 0C to 70 C -25 0 to 70C C
-40 to 85 -40C to 85 -40 to 85C -40 to 85 -40C to 85C C C C C C C 2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V
DC CHARACTERISTICS
SYMBOL PARAMETER VOH VOL VIH VIL ILI ILO ICC3 ICC2 ICC1 IPP Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Input Leakage Current Output Leakage Current VCC Power-Down Current VCC Standby Current VCC Active Current Supply Current Read 2.0 -0.3 -10 -10 MIN. VCC - 0.3 0.3 Vcc + 0.5 0.6 10 10 10 0.25 20 10 MAX. UNIT V V V V uA uA uA mA mA uA 2.7V < VCC < 3.6V VIN = 0 to 3.6V VOUT = 0 to 3.6V CE = VCC 0.3V CE = VIH CE = VIH, f=5MHz, lout = OmA, Vcc=3.6V CE = OE = VIL, VPP = VCC CONDITIONS IOH = -100uA VCC=3.0V IOL = 2.1mA, VCC = 3.0V
CAPACITANCE TA = 25oC, f = 1.0 MHz (Sampled only)
SYMBOL PARAMETER CIN COUT CVPP Input Capacitance Output Capacitance VPP Capacitance TYP. 8 8 18 MAX. 12 12 25 UNIT pF pF pF CONDITIONS VIN = 0V VOUT = 0V VPP = 0V
P/N: PM0238
6
REV. 3.6 , AUG. 20, 2001
MX27L1000
AC CHARACTERISTICS
27L1000-90 27L1000-12 27L1000-15 27L1000-20 27L1000-25 Symbol PARAMETER tACC tCE tOE tDF Address to Output Delay Chip Enable to Output Delay Output Enable to Output Delay OE High to Output Float, or CE High to Output Float tOH Output Hold from Address, 0 0 0 0 0 ns 0 MIN. MAX. MIN. 90 90 40 30 0 MAX. MIN. 120 120 50 40 0 MAX. MIN. 150 150 70 50 0 MAX. MIN. 200 200 100 60 0 MAX. UNIT CONDITIONS 250 250 120 70 ns ns ns ns CE = OE = VIL OE = VIL CE = VIL
CE or OE which ever occurred first
DC PROGRAMMING CHARACTERISTICS TA = 25oC 5C
SYMBOL VOH VOL VIH VIL ILI VH ICC3 IPP2 VCC1 VPP1 PARAMETER Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Input Leakage Current A9 Auto Select Voltage VCC Supply Current (Program & Verify) VPP Supply Current(Program) Fast Programming Supply Voltage Fast Programming Voltage 6.00 12.5 2.0 -0.3 -10 11.5 MIN. 2.4 0.4 VCC + 0.5 0.8 10 12.5 50 30 6.50 13.0 MAX. UNIT V V V V uA V mA mA V V CE = VIL, OE = VIH VIN = 0 to 3.6V CONDITIONS IOH = -0.10mA IOL = 2.1mA
AC PROGRAMMING CHARACTERISTICS TA = 25oC 5C
SYMBOL tAS tOES tDS tAH tDH tDFP tVPS tPW tVCS tCES tOE PARAMETER Address Setup Time OE Setup Time Data Setup Time Address Hold Time Data Hold Time Out put Enable to Output Float Delay VPP Setup Time PGM Program Pulse Width VCC Setup Time CE Setup Time Data valid from OE MIN. 2.0 2.0 2.0 0 2.0 0 2.0 95 2.0 2.0 150 105 130 MAX. UNIT us us us us us ns us us us us ns
P/N: PM0238
7
REV. 3.6 , AUG. 20, 2001
MX27L1000
WAVEFORMS READ CYCLE
ADDRESS INPUTS
tACC
DATA ADDRESS
CE
tCE
OE
tDF
DATA OUT
tOE
VALID DATA
tOH
FAST PROGRAMMING ALGORIHTM WAVEFORMS
PROGRAM VIH PROGRAM VERIFY
Addresses
VIL
tAS
Hi-z DATA IN STABLE DATA OUT VALID
tAH
DATA
tDS VPP1
tDH
tDFP
VPP
VCC tVPS VCC1
VCC
tVCS VCC VIH
CE
VIL tCES VIH
PGM
VIL tPW VIH tOES tOE Max
OE
VIL
P/N: PM0238
8
REV. 3.6 , AUG. 20, 2001
MX27L1000
ORDER INFORMATION
PART NO. ACCESS TIME(ns) 250 250 250 250 200 200 200 200 150 150 150 150 120 120 120 120 90 90 90 90 250 250 250 250 200 200 200 200 150 150 150 150 120 120 120 120 90 90 90 90 OPERATING 30 20 30 30 30 20 30 30 30 20 30 30 30 20 30 30 30 20 30 30 30 20 30 30 30 20 30 30 30 20 30 30 30 20 30 30 30 20 30 30 STANDBY 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 OPERATING TEMPERATURE 0 to 70 C C 0 to 70 C C 0 to 70 C C 0 to 70 C C 0 to 70 C C 0 to 70 C C 0 to 70 C C 0 to 70 C C 0 to 70 C C 0 to 70 C C 0 to 70 C C 0 to 70 C C 0 to 70 C C 0 to 70 C C 0 to 70 C C 0 to 70 C C 0 to 70 C C 0 to 70 C C 0 to 70 C C 0 to 70 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C 32 Pin DIP 32 Pin PLCC 32 Pin SOP 32 Pin TSOP 32 Pin DIP 32 Pin PLCC 32 Pin SOP 32 Pin TSOP 32 Pin DIP 32 Pin PLCC 32 Pin SOP 32 Pin TSOP 32 Pin DIP 32 Pin PLCC 32 Pin SOP 32 Pin TSOP 32 Pin DIP 32 Pin PLCC 32 Pin SOP 32 Pin TSOP 32 Pin DIP 32 Pin PLCC 32 Pin SOP 32 Pin TSOP 32 Pin DIP 32 Pin PLCC 32 Pin SOP 32 Pin TSOP 32 Pin DIP 32 Pin PLCC 32 Pin SOP 32 Pin TSOP 32 Pin DIP 32 Pin PLCC 32 Pin SOP 32 Pin TSOP 32 Pin DIP 32 Pin PLCC 32 Pin SOP 32 Pin TSOP PACKAGE
CURRENT MAX.(mA) CURRENT MAX.(uA) MX27L1000PC-25 MX27L1000QC-25 MX27L1000MC-25 MX27L1000TC-25 MX27L1000PC-20 MX27L1000QC-20 MX27L1000MC-20 MX27L1000TC-20 MX27L1000PC-15 MX27L1000QC-15 MX27L1000MC-15 MX27L1000TC-15 MX27L1000PC-12 MX27L1000QC-12 MX27L1000MC-12 MX27L1000TC-12 MX27L1000PC-90 MX27L1000QC-90 MX27L1000MC-90 MX27L1000TC-90 MX27L1000PI-25 MX27L1000QI-25 MX27L1000MI-25 MX27L1000TI-25 MX27L1000PI-20 MX27L1000QI-20 MX27L1000MI-20 MX27L1000TI-20 MX27L1000PI-15 MX27L1000QI-15 MX27L1000MI-15 MX27L1000TI-15 MX27L1000PI-12 MX27L1000QI-12 MX27L1000MI-12 MX27L1000TI-12 MX27L1000PI-90 MX27L1000QI-90 MX27L1000MI-90 MX27L1000TI-90
P/N: PM0238
9
REV. 3.6 , AUG. 20, 2001
MX27L1000
PACKAGE INFORMATION
32-PIN PLASTIC DIP(600 mil)
P/N: PM0238
10
REV. 3.6 , AUG. 20, 2001
MX27L1000
32-PIN PLASTIC SOP (450 mil)
P/N: PM0238
11
REV. 3.6 , AUG. 20, 2001
MX27L1000
32-PIN PLASTIC LEADED CHIP CARRIER (PLCC)
P/N: PM0238
12
REV. 3.6 , AUG. 20, 2001
MX27L1000
32-PIN PLASTIC TSOP
P/N: PM0238
13
REV. 3.6 , AUG. 20, 2001
MX27L1000
REVISION HISTORY
Revision No. Description 2.4 Page 3:Mode Select Table : VPP pin-"VCC" instead of " X". Revise SWITCHING TEST WAVEFORM, VOL=0.6V to VOL=0.8V. 3.0 Eliminate Interactive Programming Mode. 3.1 IPP 100uA --> 10uA 3.2 Change TSOP Orientation 3.3 Add speed 90/120ns Change VIH/VIL, VOH/VOL for 90/120ns Change CL to 30pF for 90/120ns 3.4 Cancel 32pin ceramic DIP Package 3.5 To modify Package Information 3.6 Cancel "Ultraviolet Erasable" wording in General Description Page Date 9/24/1996 6/18/1997 8/07/1997 4/09/1998 OCT/13/1999
P1,9,10 P5 P5 P1,2,9,11 FEB/25/2000 P10~13 JUL/19/2001 P1 AUG/20/2001
P/N: PM0238
14
REV. 3.6 , AUG. 20, 2001
MX27L1000
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http : //www.macronix.com
MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.
15

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